12inch （300mm） Front Opening shipping Box FOSB wafer carrier box 25pcs capacity for Wafer handling and shipping Automated operations

Short Description:

The 12-inch (300mm) Front Opening Shipping Box (FOSB) is an advanced wafer carrier solution designed to meet the high standards of the semiconductor manufacturing industry. This FOSB is specifically designed to ensure safe handling, storage, and transportation of 300mm wafers. The robust structure, combined with an ultra-clean, low-outgassing material composition, significantly reduces contamination risks while maintaining wafer integrity during critical processing steps.

FOSB boxes are crucial in modern semiconductor environments where wafer handling must be automated, precise, and contamination-free. This 25-slot capacity carrier box provides efficient space for wafer transport, minimizing mechanical stress and ensuring precise wafer positioning. With a front opening design, it offers easy access for both automated operations and manual handling when necessary. The eFOSB box is fully compliant with industry standards such as SEMI/FIMS and AMHS, making it ideal for use in automated material handling systems (AMHS) in semiconductor fabs and related production environments.

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Key Features

Feature	Description
Wafer Capacity	25 slots for 300mm wafers, offering a high-density solution for wafer transport and storage.
Compliance	Fully SEMI/FIMS and AMHS compliant, ensuring compatibility with automated material handling systems in semiconductor fabs.
Automated Operations	Designed for automated handling, reducing human interaction and minimizing contamination risks.
Manual Handling Option	Offers the flexibility of manual access for situations requiring human intervention or during non-automated processes.
Material Composition	Made from ultra-clean, low-outgassing materials, reducing the risk of particle generation and contamination.
Wafer Retention System	Advanced wafer retention system minimizes the risk of wafer movement during transportation, ensuring that wafers remain securely in place.
Cleanliness Design	Specifically engineered to reduce the risk of particle generation and contamination, maintaining the high standards required for semiconductor production.
Durability and Strength	Built with high-strength materials to withstand the rigors of transport while maintaining the structural integrity of the carrier.
Customization	Offers customization options for different wafer sizes or transport requirements, allowing clients to tailor the box to their needs.

Detailed Features

25-Slot Capacity for 300mm Wafers
The eFOSB wafer carrier is designed to accommodate up to 25 300mm wafers, with each slot spaced precisely to ensure secure wafer placement. The design allows wafers to be stacked efficiently while preventing contact between wafers, thus reducing the risk of scratches, contamination, or mechanical damage.

Automated Handling
The eFOSB box is optimized for use with automated material handling systems (AMHS), which help streamline wafer movement and increase throughput in semiconductor production. By automating the process, the risks associated with human handling, such as contamination or damage, are significantly minimized. The eFOSB box’s design ensures that it can be handled automatically in both horizontal and vertical orientation, facilitating a smooth and reliable transport process.

Manual Handling Option
While automation is prioritized, the eFOSB box is also compatible with manual handling options. This dual functionality is beneficial in situations where human intervention is necessary, such as when moving wafers to areas without automated systems or in situations requiring extra precision or care.

Ultra-Clean, Low-Outgassing Materials
The material used in the eFOSB box is specially chosen for its low outgassing properties, which prevent the emission of volatile compounds that could potentially contaminate the wafers. Additionally, the materials are highly resistant to particles, which is a critical factor for preventing contamination during wafer transport, particularly in environments where cleanliness is paramount.

Particle Generation Prevention
The box’s design incorporates features specifically aimed at preventing the generation of particles during handling. This ensures that the wafers remain free from contamination, which is crucial in semiconductor manufacturing where even the smallest particles can cause significant defects.

Durability and Reliability
The eFOSB box is made from durable materials that can withstand the physical stresses of transport, ensuring that the box retains its structural integrity over time. This durability reduces the need for frequent replacements, making it a cost-effective solution in the long run.

Customization Options
Understanding that every semiconductor production line may have unique requirements, the eFOSB wafer carrier box offers customization options. Whether it’s adjusting the number of slots, modifying the box size, or incorporating special materials, the eFOSB box can be tailored to meet specific client needs.

Applications

The 12-inch (300mm) Front Opening Shipping Box (eFOSB) is designed for use in a variety of applications within the semiconductor industry, including:

Semiconductor Wafer Handling
The eFOSB box provides a secure and efficient means of handling 300mm wafers during all stages of production, from initial fabrication to testing and packaging. It minimizes the risks of contamination and damage, which is crucial in semiconductor manufacturing where precision and cleanliness are key.

Wafer Storage
In semiconductor manufacturing environments, wafers must be stored under strict conditions to maintain their integrity. The eFOSB carrier ensures safe storage by providing a secure, clean, and stable environment, reducing the risk of wafer degradation during storage.

Transportation
Transporting semiconductor wafers between different facilities or within fabs requires secure packaging to protect the delicate wafers. The eFOSB box offers optimal protection during transportation, ensuring that wafers arrive undamaged, maintaining high product yields.

Integration with AMHS
The eFOSB box is ideal for use in modern, automated semiconductor fabs, where efficient material handling is essential. The box’s compatibility with AMHS facilitates the rapid movement of wafers within production lines, boosting productivity and minimizing handling errors.

FOSB Keywords Q&A

Q1: What makes the eFOSB box suitable for wafer handling in semiconductor manufacturing?

A1: The eFOSB box is designed specifically for semiconductor wafers, providing a secure and stable environment for their handling, storage, and transport. Its compliance with SEMI/FIMS and AMHS standards ensures it integrates seamlessly with automated systems. The box’s ultra-clean, low-outgassing materials and wafer retention system minimize contamination risks and ensure wafer integrity throughout the process.

Q2: How does the eFOSB box prevent contamination during wafer transport?

A2: The eFOSB box is made from materials that are resistant to outgassing, preventing the release of volatile compounds that could contaminate the wafers. Its design also reduces particle generation, and the wafer retention system secures the wafers in place, minimizing the risk of mechanical damage and contamination during transport.

Q3: Can the eFOSB box be used with both manual and automated systems?

A3: Yes, the eFOSB box is versatile and can be used in both automated systems and manual handling scenarios. It’s designed for automated handling to reduce human intervention, but it also allows for manual access when necessary.

Q4: Is the eFOSB box customizable for different wafer sizes?

A4: Yes, the eFOSB box offers customization options to accommodate different wafer sizes, slot configurations, or specific handling requirements, ensuring it meets the unique needs of various semiconductor production lines.

Q5: How does the eFOSB box enhance wafer handling efficiency?

A5: The eFOSB box enhances efficiency by enabling automated operations, reducing the need for manual intervention and streamlining wafer transport within the semiconductor fab. Its design also ensures wafers remain secure, minimizing handling errors and improving overall throughput.

Conclusion

The 12-inch (300mm) Front Opening Shipping Box (eFOSB) is a highly reliable and efficient solution for wafer handling, storage, and transport in semiconductor manufacturing. With its advanced features, compliance with industry standards, and versatility, it provides semiconductor manufacturers with an effective way to safeguard wafer integrity and optimize production efficiency. Whether for automated or manual handling, the eFOSB box meets the rigorous demands of the semiconductor industry, ensuring contamination-free and damage-free wafer transport at every stage of the production process.