News
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TGV (Through Glass Via) Process
TGV (Through Glass Via) Process TGV (Through Glass Via) is an advanced packaging technology that creates vertically through microvias in ultra-thin glass substrates and metallizes them to enable vertical interconnection between chips. Featuring low loss at high frequencies, low thermal stress, an...Read more -
TSMC Commits $100 Billion to Capacity Expansion
TSMC Commits $100 Billion to Capacity Expansion Taiwan Semiconductor Manufacturing Company (TSMC) is accelerating its advanced process expansion with a massive investment plan exceeding $100 billion. Its Central Taiwan Science Park (CTSP) facilities are undergoing a large-scale upgrade, triggerin...Read more -
The Age of Optical Communication: How Thin-Film Lithium Niobate and Indium Phosphide Divide the Work
In the AI optical communication industry chain, indium phosphide (InP) and thin-film lithium niobate (TFLN) play very different — yet equally indispensable — roles. One is the material that “creates the heartbeat” of optical communication, while the other “controls the bloodstream.”The former det...Read more -
Will AR Glasses Be the Hero SiC Has Been Waiting For?
Will AR Glasses Be the Hero SiC Has Been Waiting For? Not long ago, Silicon Carbide (SiC) was the darling of the semiconductor world. It promised faster charging, higher efficiency, and better performance—powering everything from electric vehicles to renewable energy systems. Investors rushed in,...Read more -
Why Do Silicon Wafers Have Flats or Notch?
Silicon wafers, the foundation of integrated circuits and semiconductor devices, come with an intriguing feature – a flattened edge or a tiny notch cut into the side. This small detail actually serves an important purpose for wafer handling and device fabrication. As a leading wafer manufac...Read more -
What Is Wafer Chipping and How Can It Be Solved?
What Is Wafer Chipping and How Can It Be Solved? Wafer dicing is a critical process in semiconductor manufacturing and has a direct impact on final chip quality and performance. In actual production, wafer chipping—especially front-side chipping and back-side chipping—is a frequent and serious ...Read more -
Patterned versus Planar Sapphire Substrates: Mechanisms and Impact on Light Extraction Efficiency in GaN-Based LEDs
In GaN-based light-emitting diodes (LEDs), continuous progress in epitaxial growth techniques and device architecture has driven the internal quantum efficiency (IQE) increasingly close to its theoretical maximum. Despite these advances, the overall luminous performance of LEDs remains fundamenta...Read more -
Understanding Semi-Insulating vs. N-Type SiC Wafers for RF Applications
Silicon carbide (SiC) has emerged as a crucial material in modern electronics, particularly for applications involving high power, high-frequency, and high-temperature environments. Its superior properties—such as wide bandgap, high thermal conductivity, and high breakdown voltage—make SiC an ide...Read more -
How to Optimize Your Procurement Cost for High-Quality Silicon Carbide Wafers
Why Silicon Carbide Wafers Seem Expensive—and Why That View Is Incomplete Silicon carbide (SiC) wafers are often perceived as inherently expensive materials in power semiconductor manufacturing. While this perception is not entirely unfounded, it is also incomplete. The true challenge is not the ...Read more -
How can we thin a wafer down to “ultra-thin”?
How can we thin a wafer down to “ultra-thin”? What exactly is an ultra-thin wafer? Typical thickness ranges (8″/12″ wafers as examples) Standard wafer: 600–775 μm Thin wafer: 150–200 μm Ultra-thin wafer: below 100 μm Extremely thin wafer: 50 μm, 30 μm, or even 10–20 μm Why a...Read more -
How SiC and GaN are Revolutionizing Power Semiconductor Packaging
The power semiconductor industry is undergoing a transformative shift driven by the rapid adoption of wide-bandgap (WBG) materials. Silicon Carbide (SiC) and Gallium Nitride (GaN) are at the forefront of this revolution, enabling next-generation power devices with higher efficiency, faster switch...Read more -
FOUP None and FOUP Full Form: A Complete Guide for Semiconductor Engineers
FOUP stands for Front-Opening Unified Pod, a standardized container used in modern semiconductor manufacturing to transport and store wafers safely. As wafer sizes have increased, and fabrication processes have become more sensitive, maintaining a clean and controlled environment for wafers has b...Read more