4inch Silicon wafer FZ CZ N-Type DSP or SSP Test grade
Introduce of wafer box
Silicon wafers are an integral part of today's growing technology sector. The semiconductor materials market requires silicon wafers with precise specifications to produce a large number of new integrated circuit devices. We recognize that as the cost of semiconductor manufacturing increases, so does the cost of those manufacturing materials, such as silicon wafers. We understand the importance of quality and cost effectiveness in the products we provide to our customers. We offer wafers that are cost-effective and of consistent quality. We mainly produce silicon wafers and ingots (CZ), epitaxial wafers, and SOI wafers.
Diameter | Diameter | Polished | Doped | Orientation | Resistivity/Ω.cm | Thickness/um |
2inch | 50.8±0.5mm | SSP DSP |
P/N | 100 | 1-20 | 200-500 |
3inch | 76.2±0.5mm | SSP DSP |
P/B | 100 | NA | 525±20 |
4inch |
101.6±0.2 101.6±0.3 101.6±0.4 |
SSP DSP |
P/N | 100 | 0.001-10 | 200-2000 |
6inch |
152.5±0.3 | SSPDSP | P/N | 100 | 1-10 | 500-650 |
8inch |
200±0.3 | DSPSSP | P/N | 100 | 0.1-20 | 625 |
The application of silicon wafers
Substrate: PECVD/LPCVD coating, magnetron sputtering
Substrate: XRD, SEM, atomic force infrared spectroscopy, transmission electron microscopy, fluorescence spectroscopy and other analytical tests, molecular beam epitaxial growth, X-ray analysis of crystal microstructure processing: etching, bonding, MEMS devices, power devices, MOS devices and other processing
Since 2010, Shanghai XKH Material Tech. Co.,Ltd has been committed to providing customers with comprehensive 4-inch wafer Silicon Wafer solutions, from debugging level wafers Dummy Wafer, test level wafers Test Wafer, to product level wafers Prime Wafer, as well as special wafers, Oxide wafers Oxide, Nitride wafers Si3N4, Aluminum plated wafers, Copper plated silicon wafers, SOI Wafer, MEMS Glass, customized ultra-thick and ultra-flat wafers, etc., with sizes ranging from 50mm-300mm, and we can provide semiconductor wafers with single-sided/double-sided polishing, thinning, dicing, MEMS and other processing and customization services.