Aluminum metal single crystal substrate polished and processed in dimensions for integrated circuit manufacturing
Specification
The following are the characteristics of aluminum single crystal substrate:
Excellent processing performance: the aluminum single crystal substrate can be cut, polished, etched and other processing to produce the required size and structure of the wafer.
Good thermal conductivity: Aluminum has excellent thermal conductivity, which is conducive to the heat dissipation of the device on the substrate.
Corrosion resistance: Aluminum substrate has certain chemical corrosion resistance and can meet the requirements of semiconductor production process.
Low cost: Aluminum as a common metal material, raw materials and production costs are relatively low, which is conducive to reducing wafer manufacturing costs.
Applications of aluminum metal single crystal substrate.
1.Optoelectronic devices: Aluminum substrate has important applications in the manufacture of optoelectronic devices such as LED, laser diode and photodetector.
2.Compound semiconductor: In addition to the use of silicon substrates, aluminum substrates are also used in the manufacture of compound semiconductor devices such as GaAs and InP.
3.Electromagnetic shielding: Aluminum as a good electromagnetic shielding material, aluminum substrate can be used to manufacture electromagnetic shielding covers, shielding boxes and other products.
4.Electronic packaging: Aluminum substrate is widely used in semiconductor device packaging, as a substrate or lead frame.
Our factory has advanced production equipment and technical team, we can provide Aluminum Single crystal substrate can be customized according to customer's specific requirements of various specifications, thickness, shape of Aluminum substrate. Welcome inquiry!