Bionic non-slip pad wafer carrying vacuum sucker friction pad sucker

Short Description:

Bionic anti-slip mat is a high-performance anti-slip product developed based on the principle of bionics. It is prepared by using advanced micro and nano manufacturing technology by simulating the microscopic characteristics of biological structures such as gecko feet and octopus suckers. This product breaks through the technical limitations of traditional non-slip materials, and realizes breakthrough functions such as glue-free adhesion, reusable, and environmental adaptive. As a new generation of intelligent anti-slip solutions, it perfectly integrates the innovation results of material science, surface engineering and mechanical design, and shows excellent application value in industrial manufacturing, medical equipment, consumer electronics and other fields.


Product Detail

Product Tags

Bionic anti-slip pad features:

• The use of special engineering elastomer composite material, to achieve no residue, pollution-free clean anti-skid effect, perfect for semiconductor manufacturing environment requirements.

• Through precision micro-nano structure array design, intelligent control of surface friction characteristics, while maintaining high friction coefficient while achieving ultra-low adhesion.

• Unique interface mechanics design enables excellent performance of both high tangential friction (μ>2.5) and low normal adhesion (<0.1N/cm²).

• Polymer materials specially developed for the semiconductor industry, which achieve stable performance without attenuation for 100,000 reuses through micro and nano manufacturing technology.

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Bionic anti-slip pad application:

(1) Semiconductor industry
1. Wafer manufacturing:
· Non-slip positioning during transmission of ultra-thin wafers up to 12 inches (50-300μm)
· Precise fixation of the wafer carrier of the lithography machine
· Wafer non-slip liner for testing equipment

2. Package test:
· Non-destructive fixation of silicon carbide/gallium nitride power devices
· Anti-slip buffer during chip mounting
· Test the shock and slip resistance of the probe table

(2) Photovoltaic industry
1. Silicon wafer processing:
· Non-slip fixation during monocrystalline silicon rod cutting
· Ultra-thin silicon wafer (<150μm) transmission non-slip
· Silicon wafer positioning of screen printing machine

2. Component assembly:
· Glass backplane laminated non-slip
· Frame installation positioning
· Binding box fixed

(3) photoelectric industry
1. Display panel:
· Non-slip OLED/LCD glass substrate process
· Precise positioning of polarizer fit
· Shock-proof and skid-proof testing equipment

2. Optical components:
· Lens module assembly non-slip
· Prism/mirror fixation
· Shock-proof laser optical system

(4) Precision instruments
1. The precision platform of the lithography machine is anti-slip
2. The measuring table of the detection equipment is shock-proof
3. Automatic equipment mechanical arm non-slip

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Technical data:

Material composition: C, O, Si
Shore hardness (A) : 50~55
Elastic recovery coefficient: 1.28
Upper tolerance temperature: 260℃
Friction coefficient: 1.8
PLASMA resistance: Tolerance

XKH Services:

XKH provides bionic anti-slip mat full process customization services, including demand analysis, scheme design, rapid proofing and mass production support. Relying on micro and nano manufacturing technology, XKH provides professional anti-slip solutions for semiconductor, photovoltaic and photoelectric industries, and has successfully helped customers achieve significant effects such as debris rate reduction to 0.005% and yield increase by 15%.

Detailed Diagram

Bionic non-slip pad 4
Bionic non-slip pad 3

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