Gold Coated Silicon Wafers 2inch 4inch 6inch Gold layer thickness : 50nm (± 5nm) or customize Coating film Au, 99.999% purity

Short Description:

Our Gold Coated Silicon Wafers are designed for use in advanced semiconductor and optoelectronics applications. Available in 2-inch, 4-inch, and 6-inch diameters, these wafers are coated with a layer of high-purity gold (Au). The standard gold layer thickness is 50nm (±5nm), with the option for customized thickness based on customer requirements. With 99.999% purity gold, these wafers provide optimal electrical and thermal properties required for high-performance applications.
The gold-coated silicon wafers offer superior electrical conductivity, excellent corrosion resistance, and enhanced thermal dissipation, making them essential in various critical applications, including semiconductor packaging, LED manufacturing, and optoelectronics. These wafers meet stringent quality standards, ensuring long-term performance and reliability in complex semiconductor processes.

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Key Features

Feature	Description
Wafer Diameter	Available in 2-inch, 4-inch, 6-inch
Gold Layer Thickness	50nm (±5nm) or customizable for specific requirements
Gold Purity	99.999% Au (high purity for exceptional performance)
Coating Method	Electroplating or vacuum deposition for a uniform layer
Surface Finish	Smooth and defect-free surface, essential for precision work
Thermal Conductivity	High thermal conductivity, ensuring effective heat management
Electrical Conductivity	Superior electrical conductivity, suitable for high-performance devices
Corrosion Resistance	Excellent resistance to oxidation, ideal for harsh environments

Why Gold Coating is Essential in the Semiconductor Industry

Electrical Conductivity
Gold is one of the best materials for electrical conduction, providing low-resistance paths for electrical current. This makes gold-coated wafers ideal for interconnection in microchips, ensuring efficient and stable signal transmission in semiconductor devices.

Corrosion Resistance
One of the primary reasons for choosing gold for coating is its corrosion resistance. Gold does not tarnish or corrode over time, even when exposed to air, humidity, or harsh chemicals. This ensures long-lasting electrical connections and stability in semiconductor devices exposed to various environmental factors.

Thermal Management
The high thermal conductivity of gold helps dissipate heat effectively, making gold-coated wafers ideal for devices that generate significant heat, such as high-power LEDs and microprocessors. Proper thermal management reduces the risk of device failure and maintains consistent performance under load.

Mechanical Strength
The gold layer adds extra mechanical strength to the wafer surface, which helps in handling, transportation, and processing. It ensures that the wafer remains intact during various semiconductor fabrication stages, especially in delicate bonding and packaging processes.

Post-Coating Characteristics

Smooth Surface Quality
The gold coating ensures a smooth and uniform surface, which is critical for precision applications like semiconductor packaging. Any defects or inconsistencies on the surface can negatively affect the performance of the final product, making high-quality coating essential.

Improved Bonding and Soldering Properties
Gold-coated silicon wafers offer superior bonding and soldering characteristics, making them ideal for use in wire bonding and flip-chip bonding processes. This results in reliable electrical connections between semiconductor components and substrates.

Durability and Longevity
The gold coating provides an additional layer of protection against oxidation and abrasion, extending the lifespan of the wafer. This is particularly beneficial for devices that need to operate under extreme conditions or have a long operational lifespan.

Increased Reliability
By improving thermal and electrical performance, the gold layer ensures that the wafer and the final device perform with greater reliability. This leads to higher yields and better device performance, which is crucial for high-volume semiconductor manufacturing.

Parameters

Property	Value
Wafer Diameter	2-inch, 4-inch, 6-inch
Gold Layer Thickness	50nm (±5nm) or customizable
Gold Purity	99.999% Au
Coating Method	Electroplating or vacuum deposition
Surface Finish	Smooth, defect-free
Thermal Conductivity	315 W/m·K
Electrical Conductivity	45.5 x 10⁶ S/m
Density of Gold	19.32 g/cm³
Melting Point of Gold	1064°C

Applications of Gold-Coated Silicon Wafers

Semiconductor Packaging
Gold-coated silicon wafers are essential for IC packaging due to their excellent electrical conductivity and mechanical strength. The gold layer ensures reliable interconnects between semiconductor chips and substrates, reducing the risk of failure in high-performance applications.

LED Manufacturing
In LED production, gold-coated wafers are used to improve the electrical performance and thermal management of the LED devices. The high conductivity and thermal dissipation properties of gold help increase the efficiency and lifetime of LEDs.

Optoelectronics
Gold-coated wafers are crucial in the production of optoelectronic devices like laser diodes, photodetectors, and light sensors, where high-quality electrical connections and efficient thermal management are required for optimal performance.

Photovoltaic Applications
Gold-coated silicon wafers are also used in the fabrication of solar cells, where they contribute to higher efficiency by improving both the electrical conductivity and corrosion resistance of the solar panels.

Microelectronics and MEMS
In microelectronics and MEMS (Micro-Electromechanical Systems), gold-coated wafers ensure stable electrical connections and provide protection from environmental factors, improving the performance and reliability of the devices.

Frequently Asked Questions (Q&A)

Q1: Why is gold used to coat silicon wafers?

A1: Gold is used due to its superior electrical conductivity, corrosion resistance, and thermal dissipation properties, which are crucial for ensuring stable electrical connections, effective heat management, and long-term reliability in semiconductor applications.

Q2: What is the standard thickness of the gold layer?

A2: The standard gold layer thickness is 50nm (±5nm). However, custom thicknesses can be tailored to meet specific application requirements.

Q3: Are the wafers available in different sizes?

A3: Yes, we offer 2-inch, 4-inch, and 6-inch gold-coated silicon wafers. Custom wafer sizes are also available upon request.

Q4: What are the primary applications of gold-coated silicon wafers?

A4: These wafers are used in a variety of applications, including semiconductor packaging, LED manufacturing, optoelectronics, solar cells, and MEMS, where high-quality electrical connections and reliable thermal management are essential.

Q5: How does gold improve the performance of the wafer?

A5: Gold enhances electrical conductivity, ensures efficient heat dissipation, and provides corrosion resistance, all of which contribute to the wafer's reliability and performance in high-performance semiconductor and optoelectronic devices.

Q6: How does the gold coating impact device longevity?

A6: The gold layer provides additional protection against oxidation and corrosion, extending the lifetime of the wafer and the final device by ensuring stable electrical and thermal properties throughout the device's operational life.

Conclusion

Our Gold Coated Silicon Wafers offer an advanced solution for semiconductor and optoelectronic applications. With their high-purity gold layer, these wafers provide superior electrical conductivity, thermal dissipation, and corrosion resistance, ensuring long-lasting and reliable performance in various critical applications. Whether in semiconductor packaging, LED production, or solar cells, our gold-coated wafers deliver the highest quality and performance for your most demanding processes.