N-Type SiC Composite Substrates Dia6inch High quality monocrystaline and low quality substrate

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N-Type SiC Composite Substrates are a semiconductor material used in the production of electronic devices. These substrates are made from silicon carbide (SiC), a compound known for its excellent thermal conductivity, high breakdown voltage, and resistance to harsh environmental conditions.


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N-Type SiC Composite Substrates Common parameter table

项目Items 指标Specification 项目Items 指标Specification
直径Diameter 150±0.2mm ( 硅 面 ) 粗 糙 度
Front (Si-face)roughness
Ra≤0.2nm (5μm*5μm)
晶型Polytype 4H Edge Chip,Scratch,Crack (visual  inspection) None
电阻率Resistivity 0.015-0.025ohm ·cm 总厚度变化TTV ≤3μm
Transfer layer Thickness ≥0.4μm 翘曲度Warp ≤35μm
空洞Void ≤5ea/wafer (2mm>D>0.5mm) 总厚度Thickness 350±25μm

The "N-type" designation refers to the type of doping used in SiC materials. In semiconductor physics, doping involves the intentional introduction of impurities into a semiconductor to alter its electrical properties.  N-type doping introduces elements that provide an excess of free electrons, giving the material a negative charge carrier concentration.

The advantages of N-type SiC composite substrates include:

1. High-temperature performance: SiC has high thermal conductivity and can operate at high temperatures, making it suitable for high-power and high-frequency electronic applications.

2. High breakdown voltage: SiC materials have a high breakdown voltage, enabling them to withstand high electric fields without electrical breakdown.

3. Chemical and environmental resistance: SiC is chemically resistant and can withstand harsh environmental conditions, making it suitable for use in challenging applications.

4. Reduced power loss: Compared to traditional silicon-based materials, SiC substrates enable more efficient power conversion and reduce power loss in electronic devices.

5. Wide bandgap: SiC has a wide bandgap, allowing the development of electronic devices that can operate at higher temperatures and higher power densities.

Overall, N-type SiC composite substrates offer significant advantages for the development of high-performance electronic devices, especially in applications where high-temperature operation, high power density, and efficient power conversion are critical.


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