News
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NVIDIA Processors Switch Heat Dissipation Materials! Silicon Carbide Substrate Demand Set to Explode!
The heat dissipation bottleneck of future AI chips is being overcome by silicon carbide (SiC) substrate materials. According to foreign media reports, NVIDIA plans to replace the intermediate substrate material in the CoWoS advanced packaging process of its next-generation processors with silic...Read more -
Major Breakthrough in 12-Inch Silicon Carbide Wafer Laser Lift-Off Technology—Beijing Jingfei Semiconductor Technology Co., Ltd.
Recently, Beijing Jingfei Semiconductor Technology Co., Ltd., a leading domestic semiconductor equipment manufacturer, has made a significant breakthrough in silicon carbide (SiC) wafer processing technology. The company successfully achieved the lift-off of 12-inch silicon carbide wafers using i...Read more -
Title: What is FOUP in Chip Manufacturing?
In the semiconductor manufacturing process, the Front Opening Unified Pod (FOUP) is a critical container used for protecting, transporting, and storing wafers. Its interior can accommodate 25 pieces of 300mm wafers, and its main components include a front-opening container and a dedicated door fr...Read more -
Wafer Cleaning Technology in Semiconductor Manufacturing
Wafer Cleaning Technology in Semiconductor Manufacturing Wafer cleaning is a critical step throughout the entire semiconductor manufacturing process and one of the key factors that directly affects device performance and production yield. During chip fabrication, even the slightest contamination ...Read more -
Wafer Cleaning Technologies and Technical Documentation
Wafer cleaning is a critical process in semiconductor manufacturing, as even atomic-level contaminants can degrade device performance or yield. The cleaning process typically involves multiple steps to remove various contaminants, such as organic residues, metallic impurities, particles, and nati...Read more -
Freshly Grown Single Crystals
Single crystals are rare in nature, and even when they do occur, they are usually very small—typically on the millimeter (mm) scale—and difficult to obtain. Reported diamonds, emeralds, agates, etc., generally do not enter market circulation, let alone industrial applications; most are displayed ...Read more -
The Largest Buyer of High-Purity Alumina: How Much Do You Know About Sapphire?
Sapphire crystals are grown from high-purity alumina powder with a purity of >99.995%, making them the largest demand area for high-purity alumina. They exhibit high strength, high hardness, and stable chemical properties, enabling them to operate in harsh environments such as high temperature...Read more -
What Do TTV, BOW, WARP, and TIR Mean in Wafers?
When examining semiconductor silicon wafers or substrates made of other materials, we often encounter technical indicators such as: TTV, BOW, WARP, and possibly TIR, STIR, LTV, among others. What parameters do these represent? TTV — Total Thickness Variation BOW — Bow WARP — Warp TIR — Tot...Read more -
Key Raw Materials for Semiconductor Production: Types of Wafer Substrates
Wafer Substrates as Key Materials in Semiconductor Devices Wafer substrates are the physical carriers of semiconductor devices, and their material properties directly determine device performance, cost, and application fields. Below are the main types of wafer substrates along with their advantag...Read more -
High-Precision Laser Slicing Equipment for 8-Inch SiC Wafers: The Core Technology for Future SiC Wafer Processing
Silicon carbide (SiC) is not only a critical technology for national defense but also a pivotal material for global automotive and energy industries. As the first critical step in SiC single-crystal processing, wafer slicing directly determines the quality of subsequent thinning and polishing. Tr...Read more -
Optical-Grade Silicon Carbide Waveguide AR Glasses: Preparation of High-Purity Semi-Insulating Substrates
Against the backdrop of the AI revolution, AR glasses are gradually entering public consciousness. As a paradigm that seamlessly blends virtual and real worlds, AR glasses differ from VR devices by allowing users to perceive both digitally projected images and ambient environmental light ...Read more -
Heteroepitaxial Growth of 3C-SiC on Silicon Substrates with Different Orientations
1. Introduction Despite decades of research, heteroepitaxial 3C-SiC grown on silicon substrates has not yet achieved sufficient crystal quality for industrial electronic applications. Growth is typically performed on Si(100) or Si(111) substrates, each presenting distinct challenges: anti-phase d...Read more