TVG process on quartz sapphire BF33 wafer Glass wafer punching

The advantages of TGV(Through Glass Via) are mainly reflected in:

1) Excellent high frequency electrical characteristics. Glass material is an insulator material, the dielectric constant is only about 1/3 of the silicon material, the loss factor is 2-3 orders of magnitude lower than the silicon material, making the substrate loss and parasitic effects are greatly reduced to ensure the integrity of the transmitted signal;

(2) Large size and ultra-thin glass substrate is easy to obtain. We can offer Sapphire, Quartz, Corning,and SCHOTT and other glass manufacturers can provide ultra-large size (>2m × 2m) and ultra-thin (<50µm) panel glass and ultra-thin flexible glass materials.

3) Low cost. Benefit from the easy access to large-size ultra-thin panel glass, and does not require the deposition of insulating layers, the production cost of glass adapter plate is only about 1/8 of the silicon-based adapter plate;

4) Simple process. There is no need to deposit an insulating layer on the substrate surface and the inner wall of the TGV(Through Glass Via), and no thinning is required in the ultra-thin adapter plate;

(5) Strong mechanical stability. Even when the thickness of the adapter plate is less than 100µm, the warpage is still small;

6) Wide range of applications. In addition to good application prospects in the field of high-frequency, as a transparent material, can also be used in the field of optoelectronic system integration, airtightness and corrosion resistance advantages make the glass substrate in the field of MEMS encapsulation has great potential.

At present, our company provides TGV(Through Glass Via) glass through hole technology, can arrange the processing of incoming materials and provide the product directly. We can offer Sapphire, Quartz, Corning,and SCHOTT, BF33 and other glasses. If you have a need, you can contact us directly at any time! Welcome inquiry!